Semiconductor manufacturing, as the pinnacle of technology-intensive industries, is continuously advancing its process nodes towards the micro-nano scale. This requires extremely strict standards for the accuracy, speed, and stability of measurement and testing equipment. Throughout the entire process from wafer manufacturing to packaging and testing, advanced measurement technologies have become the core element for ensuring product yield and consistency in performance.
The high-precision measurement system employs multi-modal technologies such as electron beam scanning, optical interference, and atomic force detection to characterize the nano-scale morphology of the wafer surface. The system fuses data from multiple sensors to construct a three-dimensional topological model of the wafer surface, and accurately measures core process parameters such as film thickness, key dimensions, and etch accuracy.
In the wafer manufacturing process, the system focuses on monitoring: the uniformity of line width in the lithography pattern, the profile of etching depth, the stress distribution in film deposition, and the surface flatness after chemical mechanical polishing. For the three-dimensional device structures such as FinFET and GAA in advanced processes, the inclined electron beam imaging and tomographic reconstruction algorithms are adopted to achieve high-fidelity restoration of complex morphology.
During the packaging test phase, the system can detect the height and coplanarity of the bumps, the integrity of the copper pillars' morphology, the line accuracy of the RDL re-routing, and the alignment deviation of the chip mounting. For the through-silicon vias (TSVs) in 2.5D/3D packaging, through ultrasonic scanning and X-ray radiography techniques, the filling quality inside the holes and the interface bonding state are evaluated.
This type of technical solution has been applied in the manufacturing processes of semiconductor products such as logic chips, memory devices, power devices, and sensors. It provides crucial data support and process optimization basis for the technological iteration and yield improvement in the industry.